High Density Microcontrollers in Small Package
SAN JOSE Calif.--(BUSINESS WIRE)--April 29, 2002--Atmel®
Corporation (Nasdaq:ATML - news) announced today the availability of its
AVR® Microcontrollers in the chip-scale Micro Lead-Frame (MLF)
Package, and as bare die. As a part of Atmel's strategy to help the
design engineers drastically reduce development costs, design time and
ultimately production costs, these packaging alternatives paired with
the AVR® 8-bit flash microcontrollers allow hardware designers to
reduce the area of a design to a fraction of what was previously used.
This can allow designers to use a less expensive PCB technology, and
will give product designer a higher degree of freedom in the visual
design without adding cost.
The three different versions of the MLF package that has been
selected are the 5X5 mm 32-pad package, the 7X7 mm 44-pad package, and
the 9X9 mm 64-pad package. Despite the very small size of the MLF
package, standard production equipment for surface mount devices can
be used. With the small size and the big ground pad under the package,
devices packaged in this technology have extremely good electrical
characteristics.
The die alternatives from Atmel can be delivered either as a whole
wafer, or as sawn die in waffle pack. Using the parts in die form will
give the smallest size and the lowest profile of the product.
"With the introduction of the highly integrated AVR 8-bit flash
microcontrollers in the MLF package, and in Die Form, system designers
can use our technology in applications with severe space constraints,"
said Jim Panfil, director of microcontroller marketing. "Paired with
the high performance AVR® Microcontroller, designs previously
requiring several integrated circuits can now be packed into an area
as small as the die itself without the need for expensive tooling for
handling it," he added.
Parts in the MLF package are available as samples now. Production
volumes will be available in May. All AVR Microcontrollers can be
delivered in die-form for production quantities now.
About Atmel
Founded in 1984, Atmel Corporation is headquartered in San Jose,
Calif., with manufacturing facilities in North America and Europe.
Atmel designs, manufactures and markets worldwide, advanced logic,
mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also
a leading provider of system-level integration semiconductor solutions
using CMOS, BiCMOS, SiGe, and high-voltage BCDMOS process
technologies.
For more information on the MLF package, go to:
http://www.atmel.com/atmel/products/prod199.htm. Requests may be sent
via e-mail to literature@atmel.com or by visiting Atmel's website at
www.atmel.com.
Note to Editors: Atmel, the Atmel logo and combinations thereof
are registered trademarks and others contained herein, are trademarks
of Atmel Corporation. Terms and product names in this document may be
the trademarks of others.
Contact:
Atmel
Jim Panfil, 408/487-2535
(Director of Microcontrollers)
jpanfil@atmel.com
Clive Over, 408/451-2855 (Director of PR/USA and Asia)
cliveover@atmel.com
Veronique Sablereau, 33 1 30 60 70 68
(Corp. Communications Manager/Europe)
veronique.sablereau@atmel.com
